OUR APPROACH
Rule Driven Design for Performance and
Signal Integrity
Printed Circuit Boards are becoming denser, signal frequencies are higher with switching times shorter. To ensure proper performance of the final product these issues receive special and professional care:
- Board Materials
- Layers Order and Line Distribution and Topology
- Impedance Control (Single Ended and Differential)
- Routing Sequence
- Termination
- Cross Talk Avoidance
- Shielding
- Signal Length Control and Matching
- Decoupling
Design For Manufacturability (DFM)
Special attention and extensive effort is dedicated, through the design, to details that effect the board manufacturing and assembly cost:
- Reduce Number of Layers
- Reduce Number of Vias
- Reduce Number of Hole Sizes and Via Types
- Accurate Land Pattern Generation
- Parts Placement and Routing Appropriate to the Assembly and Reflow Methods Used
- Ongoing Cooperation with the selected board Manufacturer
